Flexible Highly Conductive Pure Silver Epoxy Elecrically Conductive Adhesive 1 to 1 Mix Dispense, Electro-Bond 17, 5gm pouch(s)
$ 138
Availability: Currently in Stock
Delivery: 10-20 working days
Flexible Highly Conductive Pure Silver Epoxy Elecrically Conductive Adhesive 1 to 1 Mix Dispense, Electro-Bond 17, 5gm pouch(s)
Apperance - Silver
Cure Type - Room Temp / Heat Cure
Viscosity - Paste
Dissipation Factor -
Operating Temp - from –50 to +140°C
http://conductivex.com/Flexible-Highly-Conductive-Pure-Silver-Epoxy-Elecrically-Conductive-Adhesive-1-to-1-Mix-Dispense Electro-Bond 17 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require flexibility coupled with good electrical and mechanical properties. Electro-Bond 17 is a non-bleeding, electrically conductive, silver-filled epoxy formulation recommended for electronic bonding, coating, and sealing applications that require flexibility coupled with good electrical and mechanical properties. Electro-Bond 17 cures at room temperature and can be used as a flexible ""cold-solder"" for heat-sensitive components where hot-soldering is impractical. It also can be used for the assembly and repair of electrical modules, flexible circuits, membrane switches, wave guides, flat cable and high frequency shields.Appearance - Silver Benefits - EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry. Components - 2 Compressive - 6500 Cure Schedule - 24 hours @ Room Temp2 to 4 hours @ 60C Cure Type - Room Temp / Heat Cure Dielectric - 4 Dielectric - 410 Filler - Silver Glass - 35 Hardness - 63 Heat - 170 Lap - 850 Mix - 100/100 Operating - from 50 to +140C Particle Size - 44 Reactive - 100 Shelf - 1 year Shrinkage - 0.0016 Specific - 2.46 Substrates - aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board Tensile - 1240 Thermal - 1.52 Thermal - 11 Thermal - 1.4 Typical - EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry and as a cold solder for high-sensitive components where hot-soldering is impractical. Viscosity - Paste Volu