http://conductivex.com/Carbon-Filled-Electrically-Conductive-High-Strength-Epoxy-Coating-Adhesive-Dissipates-Electrostatic Electro-Bond 61 is an epoxy adhesive and coating formulation based on conductive carbon . Electro-Bond 61 is recommended for electronic bonding and sealing applications that required both electrical and mechanical properties. Electro-Bond 61 cures at room temperature or can be accelerated with mild heat to form strong bond between similar and dissimilar substrates.Appearance - Black Benefits - EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, and circuitry Components - 2 Compressive - 12000 Cure Schedule - 24 hours @ Room Temp2 to4 hours @ 60C Cure Type - Room Temp / Heat Cure Filler - Carbon Glass - 30C Hardness - 80 Heat - 100 Lap - 1850 Mix - 100/10 Operating - from 50 to +100C Particle Size - 25 Reactive - 100 Shelf - 1 year Shrinkage - 0.003 Specific - 1.18 Substrates - aluminum, copper, magnesium, steel, bronze, nickel, ceramic, glass, circuit board Tensile - 3500 Thermal - 0.25 Thermal - 1.8 Typical - EMI & RFI shielding, in the assembly or repair of printed circuit boards, waveguides, electronic modules, flat cable, high frequency shields, connections, circuitry. Viscosity - Paste Volume Resistivity - 0.004 Working - 30 Minutes